Power Electronics Packaging Engineer

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Job Title:
Power Electronics Packaging Engineer
Ford Motor Company

Job Description
Design, analyze and testing packaging aspect of power electronics systems, i.e., power modules, inductors, & capacitors for the hybrid electric vehicle (HEV) & battery electric vehicle (BEV) applications. Tasks include but not limit to: evaluating current state-of-the-art technologies in power electronics packaging area and developing new concept for the future application; building and testing prototypes to verify & quantify the new packaging concept for cost, thermal, mechanical, electrical, reliability and manufacturability benefit; performing materials characterization and failure mode analysis for power electronics; designing & carrying out reliability testing, e.g., thermal cycle, power cycle, vibration & mechanical fatigue of above components; supporting the design and development of HEV E-Drive system; design and mitigate electrical stray parameters; establish and validate cost models for the new concepts.

Required Qualifications:
  • Ph.D in Electrical, Mechanical, Aerospace, or Material Engineering, with power electronics packaging background
  • 5+years’ working or advanced research experience in various packaging techniques, tools and procedures for designing, manufacturing, developing and testing power electronics in thermal, mechanical, and electrical aspects
  • 5+years’ experience in research, concepts development and project management of novel power electronics packaging technologies, building and testing prototypes and demonstration vehicles and expertise in designing & running reliability testing, e.g., thermal cycle, power cycle, vibration and mechanical fatigue and performing failure analysis of packaging reliability issues

Preferred Qualifications:
  • Hands-on experience on materials characterization techniques, tools and processes, e.g., SEM, TEM XPS, EDS, XRD and Micro/Nano-indentation
  • Knowledge and/or experience in power devices, including silicon and wide-band-gap ones, e.g., IGBTs, MOSFETs, diodes
  • Experience in manufacturing process of transfer molding, soldering, wire bonding & sintering, 3-D printing knowledge & experience is a plus.
  • Excellent teamwork and communication skills and be able to interface with clients and engineering teams to gather and translate requirements into technical specifications
  • Experience with circuit & FEA simulation and design tools
  • Strong in experimental design (DOE), failure mode effect analysis (FMEA), & statistical data analysis
  • Self-motivated with the ability to manage multiple tasks
  • Knowledge of power electronics systems is a plus
  • HEV & BEV experience is a plus

The distance between imagination and … creation. It can be measured in years of innovation, or in moments of brilliance. When you join the Ford team discover all the benefits, rewards and development opportunities you’d expect from a diverse global leader. You’ll become part of a team that is already leading the way, with ingenious solutions and attainable products – and it is always ready to go further.

Visa sponsorship may be available for this position.

Ford Motor Company is an equal opportunity employer committed to a culturally diverse workforce. All qualified applicants will receive consideration for employment without regard to race, religion, color, age, sex, national origin, sexual orientation, gender identity, disability status or protected veteran status.